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cf4 Equipment Wika

Tetrafluoromethane, also known as carbon tetrafluoride or R-14, is the simplest perfluorocarbon (C F 4). As its IUPAC name indicates, tetrafluoromethane is the perfluorinated counterpart to the hydrocarbon methane. It can also be classified as a haloalkane or halomethane.

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  • SF6-Purity-Meter - GA50 - WIKA

    The WIKA SF 6-Purity Meter is a cost effective way to determine if the SF 6 percentage in SF 6-filled equipment meets the requirements.Tolerable limits are suggested by the cigré SF 6-Recycling Guide and the IEC 60480 for used gas. Measuring the SF 6-concentration the SF 6-Purity-Meter indirectly measures impurities of the tested SF 6-gas like air and CF4.

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  • SF6-Purity-Meter - GA50 - WIKA USA

    The WIKA SF 6-Purity Meter is a cost effective way to determine if the SF 6 percentage in SF 6-filled equipment meets the requirements.Tolerable limits are suggested by the cigré SF 6-Recycling Guide and the IEC 60480 for used gas. Measuring the SF 6-concentration the SF 6-Purity-Meter indirectly measures impurities of the tested SF 6-gas like air and CF4.

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  • Carbon tetrafluoride - Wikipedia

    Tetrafluoromethane, also known as carbon tetrafluoride or R-14, is the simplest perfluorocarbon (C F 4). As its IUPAC name indicates, tetrafluoromethane is the perfluorinated counterpart to the hydrocarbon methane. It can also be classified as a haloalkane or halomethane.Chemical formula: CF₄

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  • SF6-Purity-Meter - GA50 - WIKA Canada

    The WIKA SF 6-Purity Meter is a cost effective way to determine if the SF 6 percentage in SF 6-filled equipment meets the requirements.Tolerable limits are suggested by the cigré SF 6-Recycling Guide and the IEC 60480 for used gas. Measuring the SF 6-concentration the SF 6-Purity-Meter indirectly measures impurities of the tested SF 6-gas like air and CF4.

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  • Crossfire Wiki | Fandom

    Black Mamba is a VVIP characters set with the police soldier style. Beside the special perk in Zombie Mode, she has the unique Upward Kick perk with different attack method. Read More! Wanna contribute to this wiki? You can start editing as soon as you have registered, read the editing policy, and start contributing! Take a few moments and check out our article format before creating one. If

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  • Carbon tetrafluoride | CF4 - PubChem

    IDENTIFICATION: Tetrafluoromethane is a colorless, odorless gas. It is moderately soluble in water.USE: Tetrafluoromethane is used in the production of semi-conductors, precision parts cleaning and heat transfer applications. It is a by-product of aluminum processing. EXPOSURE: Workers that produce or use tetrafluoromethane may breathe in vapors or have direct skin contact.

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  • Test Data of etching SiO2 with CHF3/CF4-ICP1 - UCSB

    Jan 08, 2021ICP#1 Recipe: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec Date: Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o) SEM Images: 1/28/2019 I11901 110 1.35 see SEM → 5/29/2019 I11903 105 1.41 1/13/2020 I12001 78.0 1.06 unusual -

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  • Test Data of etching SiO2 with CHF3/CF4 - UCSB Nanofab Wiki

    Oct 05, 2018ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o) SEM Images

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  • Reactive-ion etching - Wikipedia

    Reactive-ion etching (RIE) is an etching technology used in microfabrication.RIE is a type of dry etching which has different characteristics than wet etching.RIE uses chemically reactive plasma to remove material deposited on wafers.The plasma is generated under low pressure by an electromagnetic field.High-energy ions from the plasma attack the wafer surface and react with it.

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  • 테트라플루오린화 탄소 - 위키백과, 우리 모두의 백과사전

    Translate this page테트라플루오린화 탄소(carbon tetrafluoride), 테트라플루오로메테인(tetrafluoromethane) 또는 사불화 탄소는 가장 간단한 플루오린화 탄소(C F 4)이다.. 탄소-플루오린 결합의 특성으로 인해 매우 높은 결합 강도를 갖는다. 할로알케인 또는 할로메테인으로 분류될 수 있다. 다수의 탄소-플루오린 결합 및

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  • Plasma enhanced chemical vapor deposition - LNF Wiki

    Apr 30, 2020Plasma enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition technology that utilizes a plasma to provide some of the energy for the deposition reaction to take place. This provides an advantage of lower temperature processing compared with purely thermal processing methods like low pressure chemical vapor deposition ().PECVD processing temperatures range

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  • SF6-Purity-Meter - GA50 - WIKA South Africa

    The WIKA SF 6-Purity Meter is a cost effective way to determine if the SF 6 percentage in SF 6-filled equipment meets the requirements. Tolerable limits are suggested by the cigré SF 6-Recycling Guide and the IEC 60480 for used gas. Measuring the SF 6-concentration the SF 6-Purity-Meter indirectly measures impurities of the tested SF 6-gas

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  • SF6 Air Sensor Analysis Siemens

    SF6 Air Sensor Analysis Siemens. In previous articles, we discussed the characteristics of SF6 (sulfur hexafluoride) gas which make it advantageous for use in medium- and high-voltage electrical equipment.

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  • SF6-Purity-Meter - GA50 - WIKA Australia

    The WIKA SF 6-Purity Meter is a cost effective way to determine if the SF 6 percentage in SF 6-filled equipment meets the requirements.Tolerable limits are suggested by the cigré SF 6-Recycling Guide and the IEC 60480 for used gas. Measuring the SF 6-concentration the SF 6-Purity-Meter indirectly measures impurities of the tested SF 6-gas like air and CF4.

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  • General Electric CF6 - Wikipedia

    The General Electric CF6, US military designation F103, is a family of high-bypass turbofan engines produced by GE Aviation.Based on the TF39, the first high-power high-bypass jet engine, the CF6 powers a wide variety of civilian airliners.The basic engine core also powers the LM2500, LM5000, and LM6000 marine and power generation turboshafts.It is gradually being replaced by the newer GEnx

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  • Intellirent products category

    Battery Test Equipment Cable and Bus Test Equipment Cable Fault Location Test Equipment Data Acquisition Electrical Safety Ground Test Equipment High Potential Test Sets High Voltage Circuit Determines SF6 and CF4 Moisture Content, Purity (Density) and SO2 Stores Data for Later Retrieval on Instrument or Download to Wika’s SF6

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  • VLE measurements and modelling for the binary systems of

    Apr 15, 2019The experimental equipment for the “static-analytic” apparatus was presented in detail in our previous work [] and will be discussed briefly herein.The schematic diagram of the equipment is shown in Fig. 1 [].The sapphire tube comprises the static equilibrium cell with an approximate capacity of 50 cm 3.Polytetrafluoroethylene o-rings were used due to their compatibility with the chemicals

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  • تترافلورومتان - ویکی‌پدیا، دانشنامهٔ آزاد

    Translate this pageTetrafluoromethane Carbon tetrafluoride دیگر نام‌ها Carbon tetrafluoride Perfluoromethane Tetrafluorocarbon Freon 14 Halon 14 Arcton 0 CFC 14 PFC 14 R 14 UN 1982 شناساگرها شماره ثبت سی‌ای‌اس 75-73-0 Y پاب‌کم 6393 کم‌اسپایدر 6153 Y UNII 94WG9QG0JN Y

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  • ICP Etching Recipes - UCSB Nanofab Wiki

    Feb 04, 2021Test Data of Etching SiO 2 with CHF3/CF4-Fluorine ICP Etcher; ICP Etch 1 (Panasonic E626I) SiO 2 Etching (Panasonic 1) Recipes. SiO 2 Vertical Etch Recipe Parameters - CHF 3 SiOVert Etch rate ≈ 2300Å/min (users must calibrate) Selectivity (SiO2:Photoresist) ≈ greater than 1:1 (users must calibrate) Historical Data (SiO2, Panasonic 1)

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  • Halocarbon 14 | Tetrafluoromethane | CF4

    Halocarbon 14 (R14, CF4, Tetrafluoromethane) Halocarbon 218 (R218, C3F8, Octafluoropropane) Halocarbon 23 (R23, CHF3, Trifluoromethane) Halocarbon 32 (R32, CH2F2, Difluoromethane) Halocarbon C318 (C4F8, Octafluorocyclobutane) Halocarbons;

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  • SF6 measuring instrument - GA50 - WIKA Alexander

    The WIKA SF6-Purity Meter is a cost effective way to determine if the SF6 percentage in SF6-filled equipment meets the requirements. Tolerable limits are suggested by the cigreacute; SF6-Recycling Guide and the IEC 60480 for used gas. Measuring the SF6

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  • SF6-Purity-Meter - GA50 - WIKA New Zealand

    The WIKA SF 6-Purity Meter is a cost effective way to determine if the SF 6 percentage in SF 6-filled equipment meets the requirements.Tolerable limits are suggested by the cigré SF 6-Recycling Guide and the IEC 60480 for used gas. Measuring the SF 6-concentration the SF 6-Purity-Meter indirectly measures impurities of the tested SF 6-gas like air and CF4.

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  • Oxford 100 Etcher | CNF Users

    Please acknowledge the CNF in your presentations, posters, and publications.. This material is based upon work supported by the National Science Foundation under Grant No. NNCI-2025233. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

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  • SAFETY DATA SHEET

    equipment: Keep container(s) exposed to fire cool, by spraying with water In case of fire, do not breathe fumes Suitable extinguishing material foam, carbon dioxide or dry agent 6. ACCIDENTAL RELEASE MEASURES Emergency procedures: Ensure adequate ventilation Shut off all ignition sources Wear suitable protective clothing and gloves.

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  • Honda Accord (sixth generation) - Wikipedia

    On the origin of these models, it is rumored that with the advent of the sixth generation Accord, Honda England were let loose to build a car that would compete with Subaru and Mitsubishis Evo.They came up with the Accord Type R, a lightened (around 1200 kg) track version with no sound deadening or luxuries. Honda Japan followed suit in 2000, took the Accord Type R and developed the Accord

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  • SF6-Purity-Meter - GA50 - WIKA United Kingdom

    The WIKA SF 6-Purity Meter is a cost effective way to determine if the SF 6 percentage in SF 6-filled equipment meets the requirements.Tolerable limits are suggested by the cigré SF 6-Recycling Guide and the IEC 60480 for used gas. Measuring the SF 6-concentration the SF 6-Purity-Meter indirectly measures impurities of the tested SF 6-gas like air and CF4.

    Get Price
  • Test Data of etching SiO2 with CHF3/CF4/O2 (using this

    Apr 06, 2020ICP#1: 0.5Pa, 50/500W, CHF3/CF4/O2=35/5/10sccm, time=210 sec Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o) SEM Images 1/28/2019 I11902 78.1 0.63 5/29/2019 I11904 71.1 0.58

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  • P5000 PECVD - LNF Wiki

    Mar 14, 2021The Applied Materials P5000 PECVD system is a multi-chamber Plasma Enhanced Chemical Vapor Deposition tool with standard operating temperatures of 200-400C.Chamber A is configured for highly conformal TEOS (SiO 2) film deposition, but is not available for processing at this time due to lack of a chemical delivery cabinet.Chamber B is configured for silicon dioxide (SiO 2) and

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  • CF4 - Leica SP5 MP/FLIM inverted | Faculty of Medicine

    Equipment CF4 - Leica SP5 MP/FLIM inverted A Leica SP5 inverted confocal microscope with a tunable infrared laser for multiphoton imaging, Flim detector, motorised stage and full incubation chamber.

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  • PT72 Etcher | CNF Users

    This 10-inch diameter parallel plate, turbo-pumped RIE system is dedicated to applications involving fluorine based plasmas including CHF3, CF4, and SF6. Applications include anisotropic etching of silicon, silicon dioxide and silicon nitride. Etch rates of common materials vary from about 10

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  • Test Data of etching SiO2 with CHF3/CF4/O2 (using this

    Apr 06, 2020Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer) From UCSB Nanofab Wiki Jump to: navigation , search

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  • Company Profile | Critical Power Products Services

    A Team with over a century of combined experience in providing value-added services for its clients in the fast-paced data center industry. Critical Power (CPPS) is your single point of contact for disposal or acquisition of reliable data center environmental and power equipment.

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  • Axic PECVD instruction - wiki.itap.purdue.edu

    25. Run CF4/O2 clean process to clean the chamber. Please make sure the chamber is clean. 26. Fill out the equipment log sheet and write your comments. 1. Change the HiVac process valve to off. Wait until you hear the vacuum valve close. 2. Change the Vent process valve to on. Wait for the process chamber to reach atmosphere.

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  • General Etching Info - CNF User Wiki - Dashboard

    PLEASE NOTE: The following information suggests etch tools for specific materials. However, (this information) is not regularly updated.For up-to-date etch rates, please see specific tool pages.

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  • Oxford 81 Etcher | CNF Users

    The Oxford PlasmaLab 80+ is an 8-inch diameter parallel plate, turbo-pumped RIE system dedicated to processes involving Fluorine based gas chemistries such as CHF3, CF4, and SF6. Processes are available to anistropically etch Silicon Dioxide, Silicon Nitride, and Silicon. Other gases available are Argon, Hydrogen, and Oxygen.

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  • Panasonic E620 ICP RIE Etcher - Birck Nanotechnology

    Jan 22, 2021Refer to the Material and Process Compatibility page for information on materials compatible with this tool. Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues.

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  • Samco PC300 Plasma Etch System (samco) | Stanford

    SNF is open under New Normal Rules.ANY shadowing must be coordinated with SNF staff first.

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  • Oxford PECVD | CNF Users

    Please acknowledge the CNF in your presentations, posters, and publications.. This material is based upon work supported by the National Science Foundation under Grant No. NNCI-2025233. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

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  • Trion Minilock III ICP Etcher | CNF Users

    SiO2 etching (CHF3/CF4/Ar) Equipment Information Sheet. Please acknowledge the CNF in your presentations, posters, and publications. This material is based upon work supported by the National Science Foundation under Grant No. NNCI-2025233. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author

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  • Did anyone have experience in etching SiO2 with SF6 in ICP

    oxide is a typical hard mask in ICP/DRIE etching. Oxide is also used as an etch stop for SF6, such as if you have a oxide nitride stack, SF6 is a great etchant to etch the nitride fast and slow a

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  • Plasma Etching | Thierry Corporation

    More complex inorganic materials and metals are etched with CF4 plasma or plasma of a similar gas mixture. Plasma Etching Functional Principles. Plasma etching is the process of converting a solid directly to a gas in a low pressure plasma system. This gas is then pumped out of the vacuum chamber at a controlled rate to optimize uniformity and

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  • Oxygen Plasma System Recipes - UCSB Nanofab Wiki

    CF4/O2 PEii SiN Etching. Pressure = 300mT–350mT; Power = 100W; Etch Rate ≈ 50-100 nm/min. Varies. Chamber Clean after CF4 Etching. Pressure = 300mT–350mT; Power = 300W; Time = 10min; Set power back to 100W before shutting off plasma! Plasma Clean (Gasonics 2000) Recipes are posted at the tool, with photoresist etch rates. Plasma Clean

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  • Oxford Dielectric Etcher (oxford-rie) | Stanford

    Optional: For background on Plasma Etching, Goto Lagunita site: Open Online Course for general information about the Lagunita online training. Go to Online Nano Course Login to log in directly to the course. Go to the Dry Etching Section for the three videos on plasma etching principles and go to the Choosing a Dry Etching Process section for guidelines for choosing the right equipment.

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  • Is CF4 polar? - Answers

    CF4 is a covalent molecule. There are four polar C-F bonds in CF4. But the dipole moments cancel off and the molecule as a whole is non-polar.

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  • McDonnell Douglas F-4 Phantom II - Wikipedia

    The McDonnell Douglas F-4 Phantom II is a tandem two-seat, twin-engine, all-weather, long-range supersonic jet interceptor and fighter-bomber originally developed for the United States Navy by McDonnell Aircraft. It first entered service in 1961 with the Navy. Proving highly adaptable, it was also adopted by the United States Marine Corps and the United States Air Force, and by the mid-1960s

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